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 MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Quad 2-Input AND Gate
The MC10H104 is a quad 2-input AND gate. One of the gates has both AND/NAND outputs available. This MECL 10H part is a functional/pinout duplication of the standard MECL 10K family part, with 100% improvement in propagation delay, and no increase in power- supply current. * Propagation Delay, 1.0 ns Typical * Power Dissipation 25 mW/Gate (same as MECL 10K) * Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) * Voltage Compensated * MECL 10K-Compatible
MC10H104
L SUFFIX CERAMIC PACKAGE CASE 620-10 P SUFFIX PLASTIC PACKAGE CASE 648-08
MAXIMUM RATINGS
Characteristic Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current -- Continuous -- Surge Operating Temperature Range Storage Temperature Range -- Plastic -- Ceramic Symbol VEE VI Iout TA Tstg Rating -8.0 to 0 0 to VEE 50 100 0 to +75 -55 to +150 -55 to +165 Unit Vdc Vdc mA C C C 4 5 6 7 10 Max 39 265 -- -0.735 -1.60 -0.735 -1.45 Unit mA A A Vdc Vdc Vdc Vdc 11 12 13
FN SUFFIX PLCC CASE 775-02
LOGIC DIAGRAM
2 3
ELECTRICAL CHARACTERISTICS (VEE = -5.2 V 5%) (See Note)
0 Characteristic Power Supply Current Input Current High Input Current Low High Output Voltage Low Output Voltage High Input Voltage Low Input Voltage Symbol IE IinH IinL VOH VOL VIH VIL Min -- -- 0.5 Max 39 425 -- Min -- -- 0.5 25 Max 35 265 -- Min -- -- 0.3 75
14 9 15 VCC1 = PIN 1 VCC2 = PIN 16 VEE = PIN 8
-1.02 -0.84 -0.98 -0.81 -0.92 -1.95 -1.63 -1.95 -1.63 -1.95 -1.17 -0.84 -1.13 -0.81 -1.07 -1.95 -1.48 -1.95 -1.48 -1.95
AC PARAMETERS
Propagation Delay Rise Time Fall Time tpd tr tf 0.4 0.5 0.5 1.6 1.6 1.6 0.45 0.5 0.5 1.75 1.7 1.7 0.45 0.5 0.5 1.9 1.8 1.8 ns ns ns VCC1 AOUT BOUT AIN AIN BIN BIN VEE
DIP PIN ASSIGNMENT
1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 VCC2 DOUT COUT DIN DIN CIN CIN DOUT
NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Iinear fpm is maintained. Outputs are terminated through a 50-ohm resistor to -2.0 volts.
Pin assignment is for Dual-in-Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6-11 of the Motorola MECL Data Book (DL122/D).
9/96
(c) Motorola, Inc. 1996
2-106
REV 6
MC10H104
OUTLINE DIMENSIONS
FN SUFFIX PLASTIC PLCC PACKAGE CASE 775-02 ISSUE C
B -N- Y BRK D -L- -M- W D Z
0.007 (0.180) M T L-M U
S
N
S S
0.007 (0.180) M T L-M
N
S
20
1
X V VIEW D-D
G1
0.010 (0.250)
S
T L-M
S
N
S
A Z R
0.007 (0.180) M T L-M 0.007 (0.180) M T L-M
S
N N
S
S
S
H
0.007 (0.180) M T L-M
S
N
S
C
E 0.004 (0.100) G G1 0.010 (0.250) S T L-M J -T-
SEATING PLANE
K1 K F VIEW S 0.007 (0.180)
M
VIEW S
S
T L-M
S
N
S
N
S
NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635).
DIM A B C E F G H J K R U V W X Y Z G1 K1
INCHES MIN MAX 0.385 0.395 0.385 0.395 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 --- 0.025 --- 0.350 0.356 0.350 0.356 0.042 0.048 0.042 0.048 0.042 0.056 --- 0.020 2_ 10 _ 0.310 0.330 0.040 ---
MILLIMETERS MIN MAX 9.78 10.03 9.78 10.03 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 --- 0.64 --- 8.89 9.04 8.89 9.04 1.07 1.21 1.07 1.21 1.07 1.42 --- 0.50 2_ 10 _ 7.88 8.38 1.02 ---
MECL Data DL122 -- Rev 6
2-107
MOTOROLA
MC10H104
OUTLINE DIMENSIONS
L SUFFIX CERAMIC DIP PACKAGE CASE 620-10 ISSUE V
9
-A-
16
-B-
1 8
C
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION F MAY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE CERAMIC BODY. DIM A B C D E F G H K L M N INCHES MIN MAX 0.750 0.785 0.240 0.295 --- 0.200 0.015 0.020 0.050 BSC 0.055 0.065 0.100 BSC 0.008 0.015 0.125 0.170 0.300 BSC 0_ 15 _ 0.020 0.040 MILLIMETERS MIN MAX 19.05 19.93 6.10 7.49 --- 5.08 0.39 0.50 1.27 BSC 1.40 1.65 2.54 BSC 0.21 0.38 3.18 4.31 7.62 BSC 0_ 15 _ 0.51 1.01
-T-
SEATING PLANE
N E F D G
16 PL
K M J
16 PL
0.25 (0.010)
M
M
TB
S
0.25 (0.010)
TA
S
-A-
16 9
P SUFFIX PLASTIC DIP PACKAGE CASE 648-08 ISSUE R
B
1 8
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 20912; Phoenix, Arizona 85036. 1-800-441-2447 or 602-303-5454 MFAX: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com
JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 03-81-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298
MOTOROLA 2-108
*MC10H104/D*
MC10H104/D MECL Data DL122 -- Rev 6


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